Articles | Volume 12, issue 1
Research article
11 Feb 2021
Research article |  | 11 Feb 2021

Formation mechanism analysis and experimental investigation of single-step printing customized circuits by liquid-metal direct writing

Yan Pu Chao, Hao Yi, Hui Cen, and Yao Hui Li

Related subject area

Subject: Machining and Manufacturing Processes | Techniques and Approaches: Experiment and Best Practice
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Cited articles

Chang, H., Guo, R., Sun, Z., Chang, H., Guo, R., Sun, Z. Q., Wang, H. Z., Hou, Y., Wang, Q., Rao, W., and Liu, J.: Direct writing and repairable paper flexible electronics using nickel-liquid metal ink, Adv. Mater. Interfaces, 5, 1800571,, 2018. 
Flowers, P. F., Reyes, C., Ye, S., Kim, M. J., and Wiley, B. J.: 3D Printing Electronic Components and Circuits with Conductive Thermoplastic Filament, Addit. Manuf., 18, 156–163,, 2017. 
Gao, Y. X., Li, H. Y., and Liu, J.: Direct writing of flexible electronics through room temperature Liquid metal ink, PLOS One, 7, 1–10,, 2012. 
Guo, R., Tang, J. B., Don, S. J., Lin, J., Wang, H. Z., Liu, J., and Rao, W.: One-Step Liquid Metal Transfer Printing: Toward Fabrication of Flexible Electronics on Wide Range of Substrates, Adv. Mater. Technol.-US, 3, 1800265,, 2018. 
Guo, R., Yao, S. Y., Su, X. Y., and Liu, J.: Semi-liquid metal and adhesion-selection enabled rolling and transfer (SMART) printing: A general method towards fast fabrication of flexible electronics, Sci. China, 62, 982–994,, 2019. 
Short summary
Liquid-metal direct writing is a cost-effective and green technology, which is very promising for the customized fabrication of flexible circuits and functional devices. The smooth flowing and conveying of liquid-metal ink are still huge challenges that need significant attention. In this paper, the force mechanism of liquid-metal ink transported by ball rotation and translation of the printing head was analyzed. The flexible complex circuit and functional electronic pattern were printed.