Mechanical properties of reactive high-entropy alloys and energy-release characteristics of projectiles impacting a multi-layer circuitry target

Shi, Zhong; Wu, Chenchen; Qiao, Wentong; Mao, Lijun; Pang, Zhaojun; Liu, Jinguo

doi:10.5194/ms-17-901-2026

Articles | Volume 17, issue 2

https://doi.org/10.5194/ms-17-901-2026

© Author(s) 2026. This work is distributed under
the Creative Commons Attribution 4.0 License.

https://doi.org/10.5194/ms-17-901-2026

© Author(s) 2026. This work is distributed under
the Creative Commons Attribution 4.0 License.

Articles | Volume 17, issue 2

Research article

|

13 Oct 2026

Research article |

| 13 Oct 2026

Mechanical properties of reactive high-entropy alloys and energy-release characteristics of projectiles impacting a multi-layer circuitry target

Zhong Shi, Chenchen Wu, Wentong Qiao, Lijun Mao, Zhaojun Pang, and Jinguo Liu

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Short summary

Three TiZr-based high-entropy alloys were fabricated via vacuum arc melting. A novel three-layer spaced target was designed to simulate combined metal-casing and internal circuitry systems. Mechanisms governing the coupled mechanical–energetic response were investigated by quasi-static and dynamic mechanical testing with post-mortem microstructural characterization and energy-release quantification.