With the rapid development of nanotechnology,
the size of a device reaches sub-nanometer scale. The larger resistivity of interconnect leads to serious overheating of integrated circuits. Silicon-based electronic devices have also reached the physical limits of their
development. The use of carbon nanotubes instead of traditional wires has
become a new solution for connecting nano-structures. Nanocluster particles
serving as brazing material play an important role in stabilizing the
connection of carbon nanotubes, which places higher demands for nanoscale
manipulation techniques. In this paper, the dynamic processes under
different operating scenarios were simulated and analyzed, including probe propulsion nanoparticle operation, probe pickup nanoparticle operation and probe pickup nanocluster particle operation. Then, the SEM (Scanning
Electron Microscope) was used for nanoparticle manipulation experiments. The
smallest unit of carbon nanotube wire was obtained by three-dimensional (3D)
construction of a carbon nanotube–silver nanocluster particle (CN-AgNP), which verified the feasibility of 3D manipulation of carbon nanotube wire construction. The experiments on the construction of carbon
nanotube–nanocluster particle structures in three-dimensional operation were completed, and the smallest unit of carbon nanotube wire was constructed.
This nano-fabrication technology will provide an efficient and mature
technical means in the field of nano-interconnection.
Introduction
Nanoparticle manipulation technology plays a crucial role in driving
multifunctional integration and microstructuring in nanomanufacturing. Every
breakthrough in nanoparticle manipulation technology can trigger
revolutionary advances in nanomanufacturing (Stergar and Osterman, 2020;
Komissarenko et al., 2020; Conradi et al., 2020; Shu et al., 2019).
Small-sized nanoelectronic devices are greatly affected by quantum
effects. Traditional semiconductor principles cannot explain this phenomenon. In recent years, scientists have proposed a method of using carbon nanotubes
instead of existing wires to achieve the functionality of connected
nanodevices (Mohsin et al., 2013; Bocko et al., 2018; Robinson and Adali,
2019). Carbon nanotube wires can be used to connect microelectrodes and
macroscopic devices owing to their excellent electrical conductivity and
microscopic properties, which can build the construction of cross-scale
systems to satisfy the high-sensitivity and high-performance functions required in the fields of biology and information (Wang et al., 2013; Yuan
et al., 2018; Bocko and Lengvarský, 2017). These new electronic devices
are still in the stage of experimentation and exploration, and the
connection method of carbon nanotube wires is still a problem to be solved.
In 2003, Fukuda developed a nano-operating platform system with 16 degrees of freedom integrated with four operating units (Fukuda et al.,
2003; Yang et al., 2016; Shi et al., 2017), which is capable of realizing
nanoscale- to millimeter-scale step motion and measuring the electrical properties (Yu et al., 2017a) and physical properties such as Young's modulus
(Fukuda et al., 2005) of carbon nanotube materials as well as controlling the construction of complex nanostructures in three dimensions (Yu et al.,
2017b). Zhang et al. (2011) developed a new
positioning device to help positioning in nano-operation. The pickup and bend processes of one-dimensional zinc oxide material under the experimental platform are carried out successfully. Bartenwerfer and
Fatikow (2012) implemented the technique of autofocusing in nano-operation
and successfully performed experiments on picking up CNT and placing it on
the substrate. Ru et al. (2010) developed an SEM operating platform, which is capable of coordinating four operating units that can perform complex testing and operational tasks. Williams et al. (2002) combined AFM and SEM to construct a system with
excellent operating and visualization performance and conducted experiments on the operation of nanowires. Zimmermann et al. (2014) used an
electron etch-shaped tungsten probe with a high aspect ratio and pocket shape as an end-effector to realize the clamping, placement and assembly of nanoparticles. The principles of large contact area and high adsorption force are used to fully utilize the probe and material adsorption force for
efficient operation.
The SEM nano-operating platform is suitable for the operation of
nanoclusters, but the current research on the operation of nanoparticles
based on the SEM platform is mainly focused on the two-dimensional operation
such as pushing and pulling. There is less research on the three-dimensional
cross-substrate operation, and the forces on nanoparticles and nanoclusters
during the operation are still unclear. In this paper, we use nanoscale
manipulation techniques to control the silver nanocluster particles that
serve as the brazing material for carbon nanotube connections. A CN-AgNP
structure is constructed through three-dimensional manipulation across
scales, which can serve as the basic unit for carbon nanotube conductors and
provide a basis for carbon nanocluster interconnection technology. Unlike
the current two-dimensional push–pull operation, the three-dimensional operation can build independent single carbon nanotube connection structures
on empty substrates, which avoids situations where the electrical properties of the substrate are affected due to the dispersion of particles on the
substrate. Since the three-dimensional operation of nanoparticles,
nanocluster particles especially have not been deeply studied and the absorption mechanism of nanoparticles and nanocluster particles is still
unclear, this article provides new ideas for the interconnection and
nanomanipulation of carbon nanotubes.
Schematic diagram of the M–D model.
Simulation analysis of manipulated nanoparticlesThe probe drives silver nanoparticles
The Maugis–Dugdale (M–D) model (Maugis, 1992) is a synthesis of the Johnson, Kendall and Roberts (JKR) model and the Derjaguin, Muller and Toporov (DMT)
model. By introducing a dimensionless Tabor, the adhesion phenomenon and the
van der Waals force outside the contact surface are integrated. The M–D theory's description of the contact situation of nano-scale objects can meet
the needs of this research, so the force model is built based on the M–D contact theory. As shown in Fig. 1, P1 is the Hertz pressure acting on the contact surface, and P2 is the adhesive force acting on the radius c, where the contact force is
N‾=a‾3-λa‾2m2-1+m2arcoss1m.
According to the M–D model, the simulation results are shown in Fig. 2. During nano-operation, the movement of nanoparticles is often achieved by
pushing the nanoparticles on the substrate plane by means of a probe. This
operation brings the probe close to one side of the nanoparticle and applies
a constant pushing force to the probe in the horizontal direction to control
sliding. During the operation, the nanoparticles are subjected to contact
and frictional forces of the substrate as well as the contact and thrust
forces of the probe. The contact force between nanoparticles and substrate
remains unchanged. Then the friction force gradually increases from zero.
The thrust between nanoparticle and substrate remains unchanged, and the
contact force increase with increasing of the relative displacement. When
the nanoparticle overcomes the maximum static friction, the contact force
remains unchanged.
After analyzing the process of probe propulsion of the nanoparticles, a
model describing the probe propulsion of silver nanoparticles on SiO2
substrate was built according to the operational process. COMSOL is used to
study the steady state of solid mechanics modules of the selected type. The nanoparticles are placed on the substrate. The probe is placed at one side
of nanoparticles. The side wall of the probe is perpendicular to the x axis. The radius of curvature of probe tip R0 is 30 nm, the radius of the nanoparticles R1 is 40 nm, and the length, width and height of the substrate are set as 400, 400, and 100 nm, respectively. The probe
material is Au. The nanoparticle material is Ag. The substrate material is
SiO2. The contact pairs of probe–nanoparticle and nanoparticle–substrate are established and set the adhesion and peeling conditions between the contact pairs. The outside surface of basilar is
constrained to establish the integral function of the opposite surface.
It can be observed that there is a contact stress between nanoparticles and
substrate before the probe contacts the silver nanoparticles. When the
silver nanoparticles is pushed by the probe, the silver nanoparticles are moved, and the contact surface between probe and substrate generates a
force. The magnitude of the force is equal to the friction between the
nanoparticles and the substrate, and it is smaller than the contact force
between the silver nanoparticles and the substrate.
The simulation of the probe driving the
nanoparticle.
The frictional curve is shown in Fig. 3. When the relative displacement is
5 nm, the contact stress is generated between the probe and nanoparticle. The
friction of the nanoparticle rises rapidly from zero to the maximum static
friction. After that, the silver nanoparticle is pushed by the probe, and
the friction gradually decreases. When the friction decreases to the sliding
friction, the friction is unchanged.
The curve of friction between the nanoparticle
and substrate.
Probe picks up silver nanoparticles
Nanomanipulation not only requires two-dimensional push operations in the
plane of the substrate, but also requires the application of spatial
three-dimensional operation methods when building complex systems.
Therefore, the study of the three-dimensional picking operation process is
necessary. The operation of the probe picking up silver nanoparticles is
studied, and the picking process obtained by simulation is shown in Fig. 4. Initially, there is a contact force between probe and nanoparticle. The
material is deformed in the process of pressing the probe, and the stress
between the contact surfaces increases significantly with the relative
displacement. In the process of lifting, adhesion occurs between probe and
nanoparticle, and peeling occurs between the nanoparticle and the substrate.
Finally, the nanoparticle is separated from the substrate with the probe to
complete the pickup operation.
Process diagram of probe picking up nanoparticles.
Figure 5 shows the change in contact stress with probe displacement during the process of picking up nanoparticles. It can be seen that the
nanoparticles elastically deform with the probe pressing down, and the
stress between the contact surfaces gradually increases. Because the
material and the shape are different, the distribution of stress will be
different. Although the net force of the two contact surfaces is equal,
their maximum stress is not entirely equal. It is divided into three stages
in the process of the probe lifting. The first stage is the contact state
between the probe and nanoparticle and the nanoparticle and substrate. As the elastic deformation of the material recovers, the contact force decreases
rapidly. In the second stage, the two contact pairs are in an attractive state. The contact force gradually decreases with the change in distance from the repulsive force and then turns into gravitational force. In the
third stage, a nanoparticle is picked up by the probe and detached from the substrate. The probe and nanoparticle are still in an attractive state, and the interaction force remains unchanged. Nanoparticle and substrate are in a
separated state, and the interaction force can be ignored.
Contact stress curve with probe displacement.
The probe picks up nanocluster particles
The simulation results are shown in Fig. 6. The nanocluster model is built
as a tetrahedral structure consisting of four nanoparticles of the same radius to simulate the process of picking up nanocluster particles from the
substrate by an analytical probe. It can be found that the probe is able to
stabilize the pickup of the nanocluster particles so that they can detach
from the substrate. The four single nanoparticles that make up the
nanocluster particles undergo relative motion during the pickup process.
When the probe is pressed down, the three nanoparticles at the bottom show a
tendency to separate outwardly. The particles at the top move down relative
to the other three particles, and the overall shape of the nanocluster
particles becomes wider and flatter. In the lifting stage of the probe, the
nanocluster particles are pulled and the overall shape is elongated. The
nanoparticles are deformed by adhesion. The relative positions of the three
nanoparticles at the bottom become closer, and the nanoparticles at the top
are farther away from the plane where the three nanoparticles at the bottom
are located. When the nanocluster particles leave the base, the force
between the nanocluster particles and the base is almost zero, and there is
contact force between the nanocluster particles and the probe. Because the
distance between the nanocluster particles and the probe remains the same,
the contact force between nanocluster particles and probe is unchanged.
Process diagram of probe pickup of nanoclusters. (a) Initial state, (b) probe contacts with nanoparticles, (c) probe is moving
down, (d) probe contacts with the bottom, (e) probe is moving up, and (f) nanoparticles detach from the substrate.
Figure 7 shows the curve of the force between nanocluster particles and
substrate. When the probe is in the same relative displacement, the contact
stress during the downforce process is greater than that during the uplift
process. This is due to the adhesion effect between the nanocluster
particles and the substrate after the downward pressure. When the probe is
lifted, the nanocluster particles will give an additional upward adhesion to
the substrate, resulting in a lower contact stress than that under the
downward pressure.
Contact stress curve with relative displacement.
Simulation results show that the contact stress exists between
nanoparticle and probe and nanoparticle and substrate during the pushing operation. The friction between nanoparticles and substrate increases
gradually. When the maximum static friction force is reached, the
nanoparticle begins to slide, and the friction force gradually decreases to
sliding friction force and finally remains unchanged. The probe can pick up silver nanoparticles and silver nanoparticle clusters on the SiO2
substrate during the pickup operation. The adhesion and peeling phenomenon
occurs between the nanoparticles and the substrate at the contact
stage. After separating from the base, the force between nanoparticles and nanocluster particles and the basement is almost zero, and there is still a
strong adhesive contact force between the probe and the nanoparticle. The
nanoparticles that constitute the nanocluster remain in the state of
binding, which can realize the stable picking operation of the nanoparticles
and the nanocluster.
Construction of carbon nanotube–nanoparticle structures
This experiment is carried out on the nanometer operating system under SEM,
which has the characteristics of real-time observation, efficient nanometer
manipulation and accurate position positioning. The AFM probe and the
dispersed sample are fixed on a clamping device and the sample clamping device, respectively, as shown in Fig. 8.
Schematic of the equipment structure.
The three-dimensional (3D) relocation of silver nanoclusters across the
substrate can be achieved through three-dimensional picking up. Silver
nanoclusters are picked up by the AFM probe to build the structure of carbon nanotube–silver nanoclusters. Silver nanocluster particles of suitable size on the ITO conductive glass substrate are selected. The silver nanocluster
particles are adsorbed on the tip of the AFM probe free from the substrate
confinement, and then the probe is moved to the end point of the scattered single carbon nanotube.
In the experiment, it was observed that the AFM probe can only adhere to the
smaller silver nanocluster particles during operation. When adsorbing the
larger silver nanocluster particles, some particles will separate from the
cluster, taking into account that silver nanocluster particles are used as solder for interconnecting carbon nanotubes. The small size of the
nanocluster particles may not be able to achieve the function of stable
interconnection between carbon nanotubes. Therefore, the best results can be
obtained by selecting silver cluster particles with a diameter of about
209.3 nm.
Nanocluster particles picked up on ITO substrate.
After selecting suitable silver nanocluster particles, three-dimensional pickup and relocation of the carbon nanotube–silver nanocluster particles were carried out; the steps are as follows.
Gradually and slowly descending the AFM probe through the Smart Act
controller until the AFM probe tip is in the same plane as the substrate
surface, at which point the AFM probe can manipulate the silver nanocluster
particles on the substrate.
The AFM probe is used to increase the contact area with silver
nanoclusters by pushing and pulling to pick up the nanocluster particles in
three dimensions. It is observed that due to the large size of the selected
nanocluster particles, the nanocluster is deformed and separated into two
parts during the pickup process, and the AFM probe could not pick up the
particles at once, so the remaining parts of the particles continued to
adhere by pushing and pulling with the AFM probe, and due to the increased
contact area, the nanocluster particles could adhere steadily to the AFM
probe. The AFM probe is lifted off the substrate, and the three-dimensional pickup of silver nanocluster particles is completed, as shown in Fig. 9.
In order to observe the adhesion state of the AFM probe to silver nanocluster particles, the probe is lifted from the substrate, the probe through the SmarACT controller rotated, the magnification reduced, and it can be
observed that the probe tips out of the silver nanocluster particle adhesion position, as shown in Fig. 10. At this time, the silver nanocluster
particles are adhered to the side of the tip of the AFM probe, and they are
flush with the tip of the probe in the vertical direction. Therefore, it is
difficult to remove the silver nanocluster particles from the AFM probe by
means of scratching or rubbing. The force of the end of the carbon nanotube
on the silver nanoparticle should be used to place the silver nanoparticle
at the target position.
The probe of the adhered nanocluster particles is rotated to the initial
state, the AFM probe is moved to the substrate of the dispersed carbon nanotubes with the appropriate concentration, and the carbon nanotubes of
the appropriate length are selected.
The AFM probe is used to place the adherent nanocluster particles on one
end of the carbon nanotube, first gradually and slowly descending the probe
until the probe tip is within the same level as the substrate plane, and then controlling the AFM probe to move within the substrate plane near the end of the carbon nanotube.
Control the AFM probe so that the silver nanoparticles adhering to the
tip of the AFM probe are facing the end point of the carbon nanotube. Then gently push the AFM probe in the direction of the carbon nanotube to
increase the tight bond between the silver nanocluster particles and the
carbon nanotube shown as Fig. 11.
Adhesion position of silver nanocluster
particles on the AFM probe.
3D construction of carbon nanotube–nanocluster cluster structure on ITO substrate.
Since the carbon nanotube–silver nanocluster structure achieves the function of replacing copper wires on the electrode substrate in practical
applications, the construction of carbon nanotube–silver nanocluster particle structure on the electrode substrate should be experimentally
verified. AFM probes are used to pick up well-dispersed silver nanoclusters
on ITO conductive glass substrates, and the diameter of the silver
nanoclusters measured is approximately 200 nm.
As shown in Fig. 12, it can be observed that the AFM probe stably picks up
the selected silver nanoclusters particles; then the carbon nanotubes are
dispersed on the electrode substrate with appropriate dispersion parameters,
and the gold substrate is selected under the observation of the scanning
electron microscope. The length and diameter of the carbon nanotubes are
3.4 µm and 104 nm, respectively. The picked silver nanocluster particles are placed at one end of the selected carbon nanotubes to complete the
construction of the carbon nanotube–silver nanocluster particle structure.
Nanocluster particles picked up on ITO glass
substrate.
In Fig. 13, it can be observed that due to the long duration of the
placement process, the carbon nanotubes in the upper right corner undergo
ablation and leave a blackish mark on the substrate in an environment where
the electron beam is continuously emitted, and the same situation occurs at
the end where the carbon nanotubes are operated. The reason is that the
structure of the carbon nanotubes becomes more fragile in an environment
where the scanning electron beam is continuously emitted, and the repeated
friction of the probe on the substrate crushes some of the carbon nanotubes
leaving a black trail.
Construction of carbon nanotube–nanocluster cluster structure at electrode substrate in three dimensions.
The silver nanocluster particles were deformed in the process of being
picked up by the AFM probe, the two parts of the clusters adhered to the AFM probe, and the adhesion position was on the side of the AFM probe tip.
Analysis of the above experimental results leads to the following
conclusions.
AFM probes can pick up smaller silver nanoclusters in three dimensions,
and as the particle size increases, the silver nanocluster will deform or
even partially detach, at which point the remaining parts can be picked up
twice in the same way to complete the pickup of the silver nanocluster particles.
Silver nanoparticles are adsorbed on the side of the AFM probe tip,
which is a more suitable location for anchoring silver nanocluster particles
to the end points of carbon nanotubes by pushing and pulling in the substrate plane.
The silver nanocluster particles were stabilized on the end points of the carbon nanotubes by the Van der Waals force, and the size and shape of the
nanocluster particles did not change significantly during the placement
process.
After placement, the nanocluster particles do not move with the
withdrawal of the AFM probe, and the particles bind to the carbon nanotubes
and stabilize, so as to achieve cross-substrate relocation to build the
carbon nanotube–nanocluster particle structure.
The three-dimensional construction of carbon nanotube–silver nanocluster particle structures is completed, and the feasibility of three-dimensional manipulation of nanocluster particles is verified.
Conclusions
With the rapid development of nanotechnology, the size of electronic
components continues to break through the limit. Therefore, higher
requirements are put forward for nanoparticle manipulation technology,
especially nanoparticle manipulation technology. This paper conducts
theoretical analysis and experimental research on nanoparticle manipulation.
This paper analyzed the dynamic process of driving nanoparticles, adsorbing
nanoparticle and adsorbing nanocluster particles by the probe. The
simulation shows that when the nanoparticle is driven by the probe, the
friction between nanoparticle and substrate is affected by the contact area.
The nanoparticle manipulation experiments were carried out under the SEM
nanoparticle manipulation platform, where silver nanocluster particles were
picked up across the substrate and placed on one end of the carbon nanotubes
on the gold substrate to complete the three-dimensional construction of
carbon nanotube–silver nanocluster particles. In this paper, the smallest unit of the carbon nanotube wire is constructed by the experiment of
building carbon nanotube–nanocluster particle structure by three-dimensional operation, which lays the foundation for carbon nanotube interconnection
technology.
Data availability
No data sets were used in this article.
Author contributions
ZY and LY established an overall paper research framework. XL and JL conducted detailed optimization and data experiments on the overall paper. XL and YD contributed to manuscript writing and data collection and analysis. LY and YW carried out paper revisions and financial support of the paper.
Competing interests
The authors declare that they have no conflict of interest.
Special issue statement
This article is part of the special issue “Robotics and advanced manufacturing”. It is not associated with a conference.
Acknowledgements
The authors are grateful to the National Key R&D Program of China.
Financial support
This research has been supported by the National Key R&D
Program of China (grant no. 2017YFB1104900).
Review statement
This paper was edited by BO LI and reviewed by four anonymous referees.
ReferencesBartenwerfer, M. and Fatikow, S.: Nanorobot-based handling and transfer of
individual silicon nanowires, Int. J. Intell.
Mech. Robot., 2, 34–46,
10.4018/ijimr.2012040103, 2012.Bocko, J. and Lengvarský, P.: Buckling of single-walled carbon nanotubes
with and without defects, J. Mech. Sci. Technol., 31,
1825–1833, 10.1007/s12206-017-0330-y, 2017.Bocko, J., Lengvarský, P., Huňady, R., and Šarloši, J.: The
computation of bending eigenfrequencies of single-walled carbon nanotubes
based on the nonlocal theory, Mech. Sci., 9, 349–358,
10.5194/ms-9-349-2018, 2018.Conradi, M., Kocijan, A., Kosec, T., and Podgornik, B.: Manipulation of TiO2
Nanoparticle/Polymer Coatings Wettability and Friction in Different
Environments, Materials, 13, 1702, 10.3390/ma13071702, 2020.Fukuda, T., Arai, F., and Dong, L.: Assembly of nanodevices with carbon
nanotubes through nanorobotic manipulations, P. IEEE, 91,
1803–1818, 10.1109/JPROC.2003.818334, 2003.Fukuda, T., Arai, F., and Dong, L.: Nanorobotic systems, Int.
J. Adv. Robot. Syst., 2, 264–275, 10.5772/5778,
2005.Komissarenko, F., Zograf, G., Makarov, S., Petrov, M., and Mukhin, I.:
Manipulation Technique for Precise Transfer of Single Perovskite
Nanoparticles, Nanomaterials, 10, 1306, 10.3390/nano10071306,
2020.Maugis, D.: Adhesion of sphere: the JKR-DMT transition using a Dugdale mode,
J. Colloid Interf. Sci, 150, 243–269,
10.1016/0021-9797(92)90285-T, 1992.Mohsin, K. M., Srivastava, A., Sharma, A. K., and Mayberry, C.: A thermal
model for carbon nanotube interconnects, Nanomaterials, 3, 229–241,
10.3390/nano3020229, 2013.Robinson, M. T. A. and Adali, S.: Buckling of elastically restrained
nonlocal carbon nanotubes under concentrated and uniformly distributed axial
loads, Mech. Sci., 10, 145–152,
10.5194/ms-10-145-2019, 2019.Ru, C., Zhang, Y., Sun, Y., Zhong, Y., Sun, X., Hoyle, D., and Cotton, I.:
Automated four-point probe measurement of nanowires inside a scanning
electron microscope, IEEE T. Nanotechnol., 10, 674–681,
10.1109/TNANO.2010.2065236, 2010.Shi, Q., Yang, Z., Guo, Y., Wang, H., Sun, L., Huang, Q., and Fukuda, T.: A
vision-based automated manipulation system for the pick-up of carbon
nanotubes, IEEE/ASME Trans. Mech., 22, 845–854,
10.1109/TMECH.2017.2649681, 2017.Shu, Y., Kang, Z., and Zhengtian, X.: Strong and High-Precision Manipulation of Nanoparticle with Graphene-Coated Fiber Systems, Plasmonics, 14, 1377–1384, 10.1007/s11468-514 019-00922-z, 2019.Stergar, J. and Osterman, N.: Thermophoretic tweezers for single
nanoparticle manipulation, Beilstein J. Nanotech., 11,
1126–1133, 10.3762/bjnano.11.97, 2020.Wang, Z., Liu, L., Wang, Y., Wang, Z., Xi, N., Hou, J., Wang, W., and Yuan,
S.: Stable Nanomanipulation Using Atomic Force Microscopy: A virtual
nanohand for a robotic nanomanipulation system, IEEE Nanotechnology
Magazine, 7, 6–11, 10.1109/MNANO.2013.2289693, 2013.Williams, P. A., Papadakis, S. J., Falvo, M. R., Patel, A. M., Sinclair, M.,
Seeger, A., Helser, A., Taylor, R. M. Washburn, S., and Superfine, R.:
Controlled placement of an individual carbon nanotube onto a
microelectromechanical structure, Appl. Phys. Lett., 80, 2574–2576,
10.1063/1.1467701, 2002.Yang, Z., Chen, T., Wang, Y., Sun, L., and Fukuda, T.: Carbon nanotubes
pickup by van der Waals force based on nanorobotics manipulation inside SEM,
Micro Nano Lett., 11, 645–649, 10.1049/mnl.2016.0287,
2016.Yu, N., Nakajima, M., Shi, Q., Yang, Z., Wang, H.P., Sun, L. N., Huang, Q.,
and Fukuda, T.: Characterization of the resistance and force of a carbon
nanotube/metal side contact by nanomanipulation, Scanning, 5910734,
10.1155/2017/5910734, 2017a.Yu, N., Shi, Q., Nakajima, M., Wang, H., Yang, Z., Sun, L. N., Huang, Q., and
Fukuda, T.: 3D assembly of carbon nanotubes for fabrication of field-effect
transistors through nanomanipulation and electron-beam-induced deposition,
J. Micromech. Microeng., 27, 105007,
10.1088/1361-6439/aa7961, 2017b.Yuan, S., Wang, Z., Xi, N., Wang, Y., and Liu, L.: AFM tip position control
in situ for effective nanomanipulation, IEEE/ASME Trans. Mech., 23, 2825–2836, 10.1109/TMECH.2018.2868983,
2018.
Zhang, Y. L., Zhang, Y., Ru, C., Chen, B. K., and Sun, Y.: A
load-lock-compatible nanomanipulation system for scanning electron
microscope, IEEE/ASME Trans. Mech., 18, 230–237,
10.1109/TMECH.2011.2166162, 2011.Zimmermann, S., Tiemerding, T., and Fatikow, S.: Automated robotic
manipulation of individual colloidal particles using vision-based control,
IEEE/ASME Trans. Mech., 20, 2031–2038,
10.1109/TMECH.2014.2361271, 2014.